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• Looking for “Package Layouter” in Germany

• 
  AN Du HOai    Premium Member

  The company name is only visible to registered members.

  Looking for “Package Layouter” in Germany

  Hi,
  
  We are looking for “Package Layouter” in Germany. Descriptions and skills are bellowed.
  
  Duration: 6 – 12 months
  
  Location: Munich (Germany)
  Nationality: German or European
  
  Job Description:
  - Routing & conceptual studies for semiconductor packaging substrate based on a given chip design or floor plan studies
  - Layout of the substrates for flip chip packages or redistributions on one-layer wafer level packages (fan-out) in our chip / package co-design environment in close coordination with Concept Engineering at the chip & package page
  - Layout of printed circuit boards for testing purposes (daisy chain routing)
  
  Skills:
  - Cadence (These are software tools used in chip design)
  - SIP
  - Allegro (These are tools for co-design if integrated circuits (ICs), packages and PCBs
  - MCM: Multi Chip Modules (could be a porous silicate based material or a specialized electronic package)
  
  If you’re interesting, please contact me or send CV via:
  resourcing-itsouth@harveynash.com.
  Our team will consider the CV then be contact with you to discuss the project further.
  Thanks and regards,
  
  An Du
  
  • 18 Feb 2012, 05:48 am
  AN Du HOai wrote: > Hi, > > We are looking for “Package Layouter” in Germany. Descriptions and > skills are bellowed. > > Duration: 6 – 12 months > > Location: Munich (Germany) > Nationality: German or European > > Job Description: > - Routing & conceptual studies for semiconductor packaging substrate > based on a given chip design or floor plan studies > - Layout of the substrates for flip chip packages or redistributions > on one-layer wafer level packages (fan-out) in our chip / package > co-design environment in close coordination with Concept Engineering > at the chip & package page > - Layout of printed circuit boards for testing purposes (daisy chain > routing) > > Skills: > - Cadence (These are software tools used in chip design) > - SIP > - Allegro (These are tools for co-design if integrated circuits > (ICs), packages and PCBs > - MCM: Multi Chip Modules (could be a porous silicate based material > or a specialized electronic package) > > If you’re interesting, please contact me or send CV via: > resourcing-itsouth@harveynash.com. > Our team will consider the CV then be contact with you to discuss the > project further. > Thanks and regards, > > An Du