Increasing material prices and the demand for continuously improving component performances are driving the development of new materials and material combinations. Bonding different materials and bonding of temperature sensitive components is therefore becoming of growing interest.
Nanobonding is using nanofoils as the heat source for a very short time soldering process. The nanostructured foil is creating an exothermal reaction, which generates temperatures up to 1200°C for a very short period of time.
The technology is very well suited for bonding of dissimilar materials, temperature sensitive components and large area bonds. Using the optimized solder material for each of the dissimilar materials and bonding them with the mechanical separation created by the nanofoils leads to strong bonds with very low stresses and distortion. The very fast processing speed of up to 30 m/min is causing minimal heat input and therefore almost no distortion of the components.