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SMT Hybrid Packaging

Kommunikationsplattform rund um Europas führende Veranstaltung für Systemintegration in der Mikroelektronik.

Bob Willis QFN LGA Soldering Defect Guides FREE at SMT Germany
Looking forward to once again presenting two workshops at SMT Germany. Also presenting on Tuesday in the forum which is always fun. Colour Defect Guides on QFN LGA and Conformal Coating I originally produced for SMART will be available FREE at my presentation and workshops at SMT see https://www.mesago.de/de/SMT/Der_Kongress/Programm_2018/14__program_detail.htm
bob@bobwillis.co.uk
Sharad Singh How Is Anti-Counterfeit Packaging Changing the Scenario of Secure Packaging In the Future
A Research Study on the Current and Future Trends of Anti-Counterfeit Packaging Market
Find out the factors responsible for the increasing demand for Anti-Counterfeit Packaging In Packaging Industry
Get the PDF sample copy of this industry Insight http://bit.ly/2reLAmF

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Über die Gruppe "SMT Hybrid Packaging"

  • Gegründet: 14.12.2015
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