About Li Auto:

We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.

About the team:

Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field. With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade SiC device packaging and application.

We welcome candidates who are passionate about pushing the boundaries of power module packaging and are eager to contribute to our team's pioneering work. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors.

1. Track industry technology trends and develop packaging technology roadmaps for power modules;

2. Responsible for power module product definition, develop power module product roadmap;

3. Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes;

4. Leading team to complete the technical development of advanced power module, output design and process files;

5. Support product development team to finish product development and import to factory for mass production.

Education/Experience

1. Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors.

2. More than 8 years of experience in power semiconductor packaging product development or technology research and development.

3. Experience in industry-leading product development and mass production is preferred.

4. Have successful experience in SiC module development, and those who develop products to achieve mass production status are preferred.

Knowledge

1. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry.

2. Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN.

3. Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect.

Skills and Competencies

1. Passionate about engineering, with a strong spirit of innovation.

2. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in the industry.

3. Familiar with power module design rules as well as simulation or structure design tools.

4. Proactive, with pioneering spirit and a good sense of internal and external client.

5. Good command of English written and oral communication skills.

HR: Penny

Email: hupan1@lixiang.com