About Li Auto:

We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.

About the team：

Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field. With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade SiC device packaging and application.

We welcome candidates who are passionate about pushing the boundaries of power module packaging and are eager to contribute to our team's pioneering work. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors.

1. Tracking SiC power module technology trends, defining power module process technology roadmap;

2. Leading team to complete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes;

3. Leading team to develop advanced power module processes, output process files;

4. Support product development team to finish product development and import to factory for mass production;

5. Support mass production process teams to solve major process issues, improve reliability and yield.

Education/Experience

1. Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields;

2. More than 8 years of experience in power semiconductor packaging product development or technology research and development;

3. Experience in industry-leading product development and mass production is preferred;

4. Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect;

5. Have successful experience in SiC module development, and those who develop products to achieve mass production status are preferred;

Knowledge

1. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry;

2. Profound knowledge of key packaging processes & corresponding equipment, e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.

Skills and Competencies

1. Proactive, with pioneering spirit and a good sense of internal and external client;

2. Passionate about engineering, with a strong spirit of innovation;

3. Good command of English written and oral communication skills；

4. Excellent team coordination and communication skills.

HR: Penny

Email: hupan1@lixiang.com