Miha Karlovsek

-Creation and release of documentation for PCB Fabrication and Assembly. -Implementing the latest DFM and DFT techniques to produce designs that are not vendor-dependent, high-quality, high-yield, and low cost. -Responsible for the schematic IN/OUT, ensuring standards are met and consistency is maintained. -Assist in maintaining standard working practices through the regular review and updating of the PCB Design Team policy and procedures documentation. -Managing PCB CAD tools and licenses.

-Design of high-density, multi-layer, digital and analog PCBs. -Determination of layer stack-up for RF and HS. -Routing techniques for DDR3/4, SERDES, RGMII, and FPGA re-pinning for minimal crossover. -Library symbol creation, managing the library database of parts. -Using Siemens software (formerly Mentor Graphics) Expedition PCB layout tool. -In-depth knowledge and completed Special Mentor Training of “FPGA IO Optimization” and “Constraint Management”. Skills: Siemens Mentor Expedition

- PCB design engineer of multilayer PCBs (FR4, IMS, Flex), - Supervise & support PCB development team members, - Capacity and resource management, - Cost reduction, Design-to-cost activities, - Employee training. Other: - Workplace health promoter, - Patent Coordinator in the field of electronics, - In charge of working procedures (Stages), - Lecture, education at the Faculty of Electrical Engineering (PCB thermal optimization)

- Multilayer designs of FR4, IMS and FLEX PCBs, - Electronics for ECU (BCM), DLP, Matrix manager layouts, - Lighting electronics for headlamps, single-function lamps and interior lighting (CCS, DC-DC, uC), - Feasibility studies based on thermal optimization and EMC compatibility, - Database for deploying data (SAP, PDM, PLM), - Employee of the year in 2014. Skills: EMC PCB solution · Cadence Allegro · Automotive · Thermal optimization

Evaluation of the degree: 10, First place in the competition for the best business idea CRMG, Participation at the Ljubljana University Incubator.