Gerhard Dörflein
Angestellt, Director Global Product Engineering, Littelfuse Europe GmbH
Hamburg, Deutschland
Werdegang
Berufserfahrung von Gerhard Dörflein
Bis heute 2 Jahre und 7 Monate, seit Okt. 2021
Director Global Product Engineering
Littelfuse Europe GmbH
Responsibilities: - Support of development projects and product launches - Analysis of product and process capabilities - Evaluation and improvement of test strategies - Cost and quality impact analysis of change requests - Statistical yield analysis and definition of improvement measures - Support customer order fulfilment - Analyze and manage production and quality issues - Manage industrial transfer activities - Identify and implement cost reduction and quality improvement measures
10 Jahre und 8 Monate, Feb. 2011 - Sep. 2021
Research & Development Manager
NXP Semiconductors GmbH
Responsible for whole research and development department of the Business Line Sensors within BU Automotive. This means: - development budget planning and tracking - Competence management - Process-, IP- and package roadmap definition and management - Execution of new technology and product development projects - Improvement of time to market and development efficiency
2 Jahre und 6 Monate, Aug. 2008 - Jan. 2011
Manager Development Program
NXP Semiconductors GmbH
Responsibilities: - Execution quality of the product development project of the market sector Sensors. - Recruiting, leading and training of project assistants, project leaders and program managers. - Controlling- and measurement of project execution quality. - Improvement of time to market. - Contiunuous improvement and deployment of existing development processes and tool infrastructure. - Project portfolio, resource management and staffing.
3 Jahre und 10 Monate, Okt. 2004 - Juli 2008
Program Manager
Infineon Technologies AG
Program manager automotive technology development. I am responsible for business cases, controlling and alignment of several international subprojects. Target is to develope new profitable products within committed timeframes.
Definiton of semiconductor packaging roadmads and technology requirements. Start of development projects or IP-sourcing to fulfil the roadmap targets.
3 Jahre und 4 Monate, Okt. 1999 - Jan. 2003
Senior Manager Product Engineering and Process Integration
Infineon TechnologiesRessource manager of an engineering team that was responsible for the integration and ramp up of new semiconductor technologies and ASICs. - Hiring of new team members and team integration. - Team and task planning - Definition and adaptation of new business processes
Production-, test- and design-stability analysis of high frequency ASICs. Start and controlling of optimization measures to increase and stabilze product yields.
1 Jahr und 1 Monat, Sep. 1995 - Sep. 1996
Software Develpment
Architectural Computing Intelligence
Software Development, Customer Training and Support
Ausbildung von Gerhard Dörflein
1 Jahr und 1 Monat, Okt. 1992 - Okt. 1993
Physics
State University of New York at Buffalo
Solid state semiconductor quantum hall characterization of GaAs-structures
5 Jahre und 11 Monate, Okt. 1989 - Aug. 1995
Physics
Julius Maximilians University Würzburg
Applied Physics (light scattering and reflection of polymers)
Sprachen
Deutsch
Muttersprache
Englisch
Fließend