Dr. Heiko Hein

Head of R&D project portfolio and program management in the building technologies industry with a global team distributed over Europe, India, USA and China. Full responsibility for products, projects, budget, roadmap, financial and development goals as well as the portfolio's strategic direction of content, staff and global distribution of activities. The FS Digitalization & APPs Portfolio comprises worldwide all Siemens FS Segment Cloud based solutions.

Head of R&D project portfolio and program management in the building technologies industry. Full responsibility for products, projects, budget, roadmap, financial and development goals as well as the portfolio's strategic direction of content, staff and global distribution of activities. The Standalone Panels Portfolio comprises worldwide all Siemens Fire Safety and Extinguishing System Panels that are not able to network.

Management of large global R&D projects in the area of fire systems. Worldwide multiple site development & production. Outsourcing, insourcing, offshoring, OEM, ODM.

Globale Leitung eines Projektes zur Entwicklung einer neuen Generation von netzwerkfähigen Brandmeldezentralen für UL Märkte (Fokus Nord & Südamerika, teilw. Asien u. Mittl. Osten). Gesamtverantwortung aller Sach- Kosten- Qualitäts- und Terminziele. Damit verantwortlich für die Gesamtentwicklung, den Aufbau neuer globaler Teams, sowie die Integration von Fremdfirmen, Offshorepartnern und Produktion in bestehende Strukturen. Teamgrösse >150 Personen in 5 Ländern (USA, Schweiz, Deutschland, Slowakei, China).

Coordination of project portfolios, planning and management of projects in the security and intrusion area. OEM / ODM project management. Senior engineering and consulting for all topics related to RF, ASIC, analog IC-design and wireless system implementation.

Project manager IC design analog, RFICs, high speed analog asics for wireless communication in CMOS, BiCMOS, SiGe, GaAs, feasibility studies, integrated transmitters and receivers, RF CMOS design, senior engineering

Untersuchungen zur vollständigen Integrierbarkeit von Empfängern in Standard CMOS Technologie