Roger Stierman

Materials Scientist and Failure Analyst, Packaging. 25 Years helping people determine what broke, invesitgating why it broke, and recommending actions to keep it from breaking again. Packaging materials research on die attaches, mold compounds, wire bond and solder interconnections, flip-chip connections and underfills, package-to-PWB mounting and reliability. Wire bond and solder IMC's a specialty. Utilized and taught precision cross-sectioning, SEM/EDS, X-Ray, SAM, tensile and 4-point bend testing.

Low-temperature magnetic properties of rare earth metals.

Superconductivity