Ing. salvatore speciale
Angestellt, Yield Technical Staff Member, Intel Corp.
Dublin, Irland
Über mich
More than 24 years of experience working in a World-Wide semiconductor industry with Project Management & six sigma Black Belt certifications. Roles: - Device Integration Expert for Front end Manufacturing Product Yield Improvement, PCM & Inline correlation, Monitoring & control. - Technologies Development & New Product Introduction for automotive & consumers applications. - Project Manager for Technology silicon Scale up & test chip development - Transfer, ramp up & full industrialization of several technologies. - Leading Programs of Yield improvement step up, continuous Improvement, Cost saving and technologies alignment. - Product Device targeting and Line stability control, RCA investigation, actions to recovery deviation for device re-targeting. - Yield & Process integration experience on Electrical Parametric test, Big Data analysis using the best practise of Lean six sigma: Problem Solving 8D, DOE, DMAIC, Process changes review Board (PCRB), risk assessment FMEA.
Werdegang
Berufserfahrung von salvatore speciale
2 Jahre und 6 Monate, Sep. 2020 - Feb. 2023
Technology development Manager
STMicroelectronics
BCD & Power & Discrete Technology Device for Product project Manager - Device expert Responsible for electrical Characterization, fast Technology transfer, ramp up & industrialization phases. - Product Device responsible to assure Product & Technology - Quality, Reliability, Yield improvement, Parametric Process alignment & WLR Qualification KPIs. - Technology Test chip Development Project Manager - Responsible to develop WLR 4.0 Strategy
2 Jahre und 6 Monate, Sep. 2020 - Feb. 2023
TECHNOLOGY DEVELOPMENT MANAGER
STMicroelectronics
1 Jahr und 11 Monate, Okt. 2018 - Aug. 2020
Technical staff Device and Technology transfer, Project Manager
Robert Bosch Semiconductor Manufacturing Dresden GmbH
- BCD & Power & Discrete Technology Device for Product - Device expert Electrical Characterization, - Technology transfer, ramp up & industrialization. - Reliability, Product & Technology Quality. - Yield improvement, Parametric Process alignment. - Project Manager test chip development. - Device targeting.
6 Jahre, Okt. 2012 - Sep. 2018
MTS - Member of Technical Staff Integration & Yield Device Engineer
GLOBALFOUNDRIES- Member of Technical Staff (MTS) Technology, Device Integration & Yield. - Project Management. - Device targeting. - Device Integration & Device parametric test. - Technology Ramp up and full industrialization, Process technology transfer and mass production full maturity. -Yield improvement master plan tasks. - PolySiON Bulk, HKMG, FDSOI, eSiGe process options, Technology node 28nm. TECHNOLOGICAL NODE: 60nm, 180nm, 150nm, 110nm, 28nm, 22nm.
12 Jahre und 11 Monate, Nov. 1999 - Sep. 2012
Senior Device Engineer Project leader & Senior Process control engineer
STMicroelectronics
-Litho Process Engineer metrology for process control, SPC and APC -Project Leader process control & robustness programs -Device Integration & parametric Test engineer flash memories. -Device for Technology transfer, ramp up & full industrialization of BCD, HVG & HVCMOS. -Parametric Test team Leader & Manufacturing Technology Integration Staff. -Member of corporate steering committee for Parametric Test procedures & methods standardization. -Project Manager for outsourcing processes to a foundry.
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Italienisch
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