In this role at TI you will experience how the latest and most innovative technologies for step down DCDC converters are developed, built and optimized. You will join a team that develops buck converters which are powering future solutions in automotive, industrial or personal electronics. Making people’s lives easier, safer and greener!

Some of your responsibilities will include, but are not limited to:

• Collaborate with product engineering teams, layout and manufacturing teams in the debugging of new semiconductor packages by running mechanical and thermal simulations in Ansys and Cadence

• Understand different semiconductor package technology as well as constraints and dependencies of electrical, mechanical and thermal behavior

• Run thermal simulations to evaluate and better understand package thermal behaviors to order to drive future package improvements

• Drive improvements in simulation setups for better usability and process optimization

• Setting up and qualifying products within our TI’s manufacturing processes and flows

• Cooperating closely with multiple product development functions and worldwide packaging and AT sites teams

Minimum Requirements:

• Ongoing Master‘s/Bachelor’s degree in Electrical Engineering, Microsystems Technology, Material Science, Physics or a related field
• Experience in Ansys, Cadence or similar modelling/simulations SW tools

Preferred Qualifications:

• Experience with scripting in Phyton is an advantage
• Demonstrated strong analytical and problem-solving skills
• Ability to take initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Excellent communication and presentation skills
• Ability to work in teams and collaborate effectively with people in different functions
• High motivation for continuous learning - every day might be different
• Knowledge or high interest about semiconductor fabrication processes, manufacturing flows and reliability testing, including electrical, physical, mechanical and chemical interaction of various components going into a semiconductor device
• Strong understanding of semiconductor device physics, IC packaging, and failure analysis techniques is a plus

Our offer for you:

• Benefit from an attractive compensation
• Join an international work environment where your ideas count and where you can thrive in a diverse culture
• Explore a world of opportunities for your personal and professional development

Put your talent to work with us as a Product Engineer Intern or Student Worker - change the world, love your job!

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.