Join a Team That Builds the Future of Computing

At IBM’s largest European R&D site in Böblingen/Ehningen, Germany, innovation is a team effort. With 1,300 employees and around 200 engineers in our hardware development team, we’re shaping the future of computing — together.

We design the core components behind IBM Z, IBM POWER, and Quantum systems — technologies that power cloud computing, AI, big data, and more. What sets us apart is how we work: across borders, disciplines, and ideas. You’ll collaborate daily with colleagues in the U.S., Israel, and India, using Agile and Design Thinking to drive creativity and continuous learning.

If you're passionate about technology and thrive in a collaborative, forward-thinking environment, we’d love to meet you.

• Structural Test: Execute structural test patterns during wafer-level and chip-level testing

• Functional Test: Apply sequences of test patterns during wafer or chip testing to initialize the processor under test and trigger Built-In Self-Test (BIST) or functional test procedures

• Characterization: Conduct functional and structural tests across various temperature, voltage, and process corners to verify product performance under diverse operating conditions

• Failure Analysis: Collaborate closely with the processor design and DFT (Design for Test) teams to identify root causes of failures

• Test Pattern Updates: Update test patterns from the DFT team to tailor them for specific tests during debug and failure analysis

• Test Data Analysis: Leverage advanced data analytics, including machine learning and data mining techniques, to extract insights from large-scale wafer and chip test datasets
• Test Flow Development & Automation: Design, implement, and continuously enhance automated test flows to address the increasing complexity of modern processor architectures and improve test efficiency
• State of the Art Test Equipment: Operate sophisticated wafer and chip testing equipment

We’re looking for university graduates or professionals with up to 3 years work experience and a background in chip design or chip test. Ideally, you have:

• Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related field
• Foundational understanding of processor architecture
• Basic familiarity with semiconductor technologies
• Introductory knowledge of circuit and chip design
• Experience with chip or wafer testing is a plus
• Proficiency in programming, preferably in Python and C++
• Experience with data analysis or data mining techniques is advantageous
• Strong motivation to learn and tackle complex problems
• Excellent team collaboration skills
• Effective communication in German and English