Job Title: Thermal and Fluid Simulation Engineer (Semiconductor Packaging)

Contract Duration: 12 Months
Location: Neubiberg, Bavaria (BY), Germany
Start Date: ASAP

Work Model:

• Onsite for the first two weeks on site
• Remote thereafter

About the Role:

We are seeking an experienced Thermal and Fluid Simulation Engineer to support the characterization and development of advanced power semiconductor packages and modules. This role involves simulation work across package, board, and system levels using industry-standard CFD and FEM tools.

• Perform thermal simulations for semiconductor packages and modules at various integration levels (package, board, and system)
• Generate simulation and compact models for end customers using Ansys Icepak and Simcenter Flotherm
• Analyze and optimize thermal management and cooling solutions for system-level integration of Infineon products
• Document and report simulation models, results, and key findings

Deliverables:

• Validated thermal simulation models
• Analysis reports and technical documentation
• Compact thermal models suitable for customer delivery

Skills:

• Master’s degree in Mechanical Engineering, Electronics, Aerospace Engineering, Physics, or a related field
• 5–7 years of hands-on experience in thermal FEM/CFD simulation
• Strong expertise in tools such as:
• Ansys Mechanical, Icepak, CFX, or Fluent
• Simcenter Flotherm and/or FLOEFD
• Ability to create and modify 3D CAD geometries for simulation
• Experience in the thermal simulation of semiconductor or microelectronic devices
• Familiarity with thermal compact modeling and customer delivery standards