Contract or Permanent position available

Lead highly complex PCB/Substrate Layout designs for complex RF and electro optical designs. Responsible for ensuring technical milestones are achieved. Ensures specification requirements input and design outputs align.

What will you do?

• Execution implementation of PCB layouts, including the creation of component symbols and footprints
• Provide feedback and guidance on substrate technology and processes
• Perform, review and implement design for manufacturing analysis and reports
• Layout and build files including PCB design, ceramic substrate design, organic substrate design, and complex multi-layer packaging design
• Work with external PCB suppliers/manufacturers and provide input to their product roadmaps
• Communicates technical aspects of a project effectively to management
• May perform other duties and responsibilities as assigned

Experience:

• 8+ years’ experience in embedded hardware design or other key competency is required
• Experience with PCB development and understanding of PCB constraints is required
• Experience with Cadence CIS and Cadence Allegro is required
• Understanding of analog and digital electronics is required

Knowledge, Skills, Abilities:

• Experience with HDI (High Density Interconnect) and MSAP is an asset
• Familiarity with PCB fabrication processes, DFM best practices and IPC Certification (CID, CID+) are all a plus
• Influence others and share best practices
• Effectively communicate with good understanding of English
• Assess a project and articulate risk while developing project milestones
• Mentor less experienced designers

Please get in touch with Christina McGuire to hear more!