At IBM’s largest European R&D site in Böblingen/Ehningen, Germany, innovation is a team effort. With 1,300 employees and around 200 engineers in our hardware development team, we’re shaping the future of computing — together.

We design the core components behind IBM Z, IBM POWER, and Quantum systems — technologies that power cloud computing, AI, big data, and more. What sets us apart is how we work: across borders, disciplines, and ideas. You’ll collaborate daily with colleagues in the U.S., Israel, and India, using Agile and Design Thinking to drive creativity and continuous learning.

Do you want to pursue a Master’s degree while gaining valuable hands-on experience at one of the world’s leading technology companies?

Then Master@IBM study&work is the perfect opportunity for you! As a participant in this program, you will combine a Master’s degree with exciting projects and cutting-edge technologies in a dynamic work environment. Throughout your studies, you will be actively involved in our product development and build strong professional connections for your future career.

Wafer/Chip Test & Characterization Engineer

We’re seeking skilled and motivated Master@IBM student to join our Wafer/Chip Test & Characterization team. In this role, you’ll play a key part in validating and enhancing IBM’s high-performance processors, which drive our industry-leading computing platforms.

Key Areas of Work

Test & Characterization: Perform detailed measurements and analysis of critical performance parameters such as timing, leakage currents, and noise margins to validate and optimize processor designs

Failure Analysis: Collaborate closely with design, DFT (Design for Test), and process engineering teams to identify root causes of silicon failures

Test Data Analysis: Leverage advanced data analytics, including machine learning and data mining techniques, to extract insights from large-scale wafer and chip test datasets

Test Flow Development & Automation: Design, implement, and continuously enhance automated test flows to address the increasing complexity of modern processor architectures and improve test efficiency

State of the Art Test Equipment: Operate sophisticated wafer and chip testing equipment

The planned start date is the winter semester 2026/2027.

To apply for the Master's program at IBM, please submit your CV, your high school diploma, your transcript of records and a letter of motivation. Kindly ensure that all documents are merged into one single PDF file before uploading.

What you bring:

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a related field

Foundational understanding of processor architecture

Basic familiarity with semiconductor technologies

Introductory knowledge of circuit and chip design

Experience with chip or wafer testing is a plus

Proficiency in programming, preferably in Python and C/C++

Experience with data analysis or data mining techniques is advantageous

Strong motivation to learn and tackle complex problems

Excellent team collaboration skills

Effective communication in German and English language