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Senior Director & Team Lead of Security Vulnerability Analysis

Senior Director & Team Lead of Security Vulnerability Analysis

Senior Director & Team Lead of Security Vulnerability Analysis

Senior Director & Team Lead of Security Vulnerability Analysis

NXP Semiconductors

Halbleiter, elektronische Bauteile

Hamburg

  • Art der Beschäftigung: Vollzeit
  • 105.500 € – 132.000 € (von XING geschätzt)
  • Vor Ort
  • Zu den Ersten gehören

Senior Director & Team Lead of Security Vulnerability Analysis

Über diesen Job

Position Summary

The Team Lead – Security Vulnerability Analysis is responsible for leading a multidisciplinary team focused on the proactive identification, analysis, and mitigation of security vulnerabilities in semiconductor products, embedded systems, and related firmware. This leader drives innovative approaches to hardware and software security testing, project execution and team management

The role requires a combination of deep technical expertise, leadership capability, and forward‑thinking strategy to guide a high‑performing team in a fast‑evolving security landscape.

Key Responsibilities

1. Team Leadership & People Management

  • Lead, mentor, and develop a specialized team of security analysts and engineers.
  • Foster a culture of innovation, proactiveness, and continuous learning.
  • Define team goals, priorities, and growth plans aligned with company objectives.
  • Provide coaching, performance feedback, and support for professional development.

2. Strategic & Proactive Security Direction

  • Define the long‑term technical strategy for vulnerability analysis.
  • Identify emerging attack vectors and proactively integrate innovative techniques into the team’s workflows.
  • Collaborate with the BL Leadership to ensure security considerations are embedded in product roadmaps.

3. Oversight of Vulnerability Analysis & Testing

  • Oversee systematic vulnerability assessments of semiconductor devices, IP blocks, SoCs, and firmware.
  • Guide the team in applying advanced techniques including.
  • Ensure the development of creative test methodologies, tooling strategies, and advanced lab setups.
  • Validate high‑impact findings and support internal teams in remediation planning.

4. Cross‑Functional Collaboration & Security Advocacy

  • Partner with IC design, product security, firmware engineering, verification, and quality teams.
  • Influence architecture and design decisions by providing authoritative security guidance.
  • Represent the Security Vulnerability Team in internal reviews, audits, and customer discussions.
  • Advocate for proactive security across all engineering and product groups.

5. Reporting, Governance & Continuous Improvement

  • Ensure high‑quality reporting of vulnerabilities, risk levels, and mitigation recommendations.
  • Present results to technical leadership, executives, and customer stakeholders.
  • Drive process improvements, tooling enhancements, lab development, and automation initiatives.
  • Ensure compliance with relevant standards such as FIPS, Common Criteria, NIST, and ISO/SAE 21434.
Required Qualifications
  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Embedded Systems, Cybersecurity, or a related field.

Technical Experience

  • 10+ years embedded security experience
  • Strong understanding of semiconductor architectures, secure design, and cryptographic implementations.

Leadership Experience

  • Experience leading engineers, technical teams, or complex cross‑functional security initiatives.
  • Ability to translate complex technical challenges into clear strategic direction.
  • Skilled at fostering collaboration and motivating teams.

Preferred Qualifications

  • Experience with security‑certified products such as Automotive ECUs, IoT devices, or secure elements.
  • Knowledge of secure architecture design and semiconductor IP security.
  • Experience driving lab automation, new security tooling adoption, or innovative test frameworks.
  • Familiarity with vulnerability disclosure programs and secure product lifecycle management.

Soft Skills

  • Proactive, visionary mindset with strong strategic thinking.
  • Excellent communication and stakeholder management skills.
  • High degree of creativity paired with structured problem‑solving ability.
  • Confident decision‑making and ability to handle ambiguity in fast‑paced environments.
  • Strong team‑building and leadership presence.

More information about NXP in Austria...

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Unternehmens-Details

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NXP Semiconductors

Halbleiter, elektronische Bauteile

1-10 Mitarbeitende

Hamburg, Deutschland

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