Your tasks

• Develop mixed-signal RFIC chip packages by performing electromagnetic and thermal simulations alongside designing the layout.
• Collaborate closely with chip and PCB design teams to define and align system-level requirements.
• Drive the development of innovative eWLB and advanced heterogeneous packaging concepts.
• Coordinate with the purchasing department to engage with external suppliers, ensuring alignment on both technical and commercial objectives.
• Plan and execute qualification processes in close cooperation with the quality assurance team.

Your qualifications

• A degree in communications engineering, electrical engineering, microelectronics, physics, or a related discipline.
• Minimum of 3 years of professional experience in RF and analog design.
• Proficiency in electromagnetic simulation tools (e.g., CST, Ansys HFSS).
• Familiarity with package layout tools (e.g., Cadence APD) is advantageous.
• Solid understanding of key areas such as IC design, PCB layout and manufacturing, and thermal management.
• Strong intercultural competence and willingness to travel internationally on occasion.
• High level of initiative, autonomy, and a structured approach to problem-solving.
• Excellent collaboration and coordination skills across multidisciplinary teams.
• Effective time management and the ability to prioritize tasks.
• Proficiency in both written and spoken German and English.

Interested?