Key Responsibilities:

• Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.

• Review customer schematics and layouts for signal‑integrity and power‑integrity best practices (impedance control, terminations, return paths, via design, reference plane strategy).

• Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.

• Provide on‑site or remote debug support for complex customer issues.

• Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.

• Participate in trade shows and provide FAE training

Qualifications

• Bachelor’s degree or above in Electrical/Electronic Engineering or related field.

• Extensive experience (7+ years) in hardware design, applications engineering, or system validation.

• Strong understanding of high‑speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking.

• Demonstrated experience with multi‑Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes).

• Proficiency with SI/PI tools and simulations (e.g., S‑parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation.

• Hands‑on experience using lab equipment: high‑bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools.

• Strong skills in PCB design for high‑speed: layer stack‑up, routing constraints, differential pairs, reference planes, decoupling, and power delivery.

• Excellent communication and presentation skills to explain complex technical topics to both expert and non‑expert audiences. ⁽⁵⁾

• Ability to work effectively with global, cross‑functional teams (design, systems, test, marketing, field).

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