• Develop post-CMOS manufacturing processes in collaboration with Fab Engineering, from concept design through implementation
• Act as the interface between layout, test, and quality teams, ensuring timely execution of project-related tasks in alignment with the project plan
• Definition, implementation, and analysis of experiments
• Lead the characterization of technologies through testing and analysis, and compile comprehensive, data-driven reports
• Propose innovative process and device concepts, contributing to the company’s intellectual property portfolio through patent submissions
• Collaborate in a team-oriented environment with a strong emphasis on documentation, quality, and timely project delivery
• Take ownership of work packages and lead sub-teams within larger projects
• Develop and maintain detailed work plans, identify gaps and risks, and implement solutions to ensure successful project completion
• Apply structured problem-solving methodologies (e.g., 8D, Fishbone) and conduct risk assessments (e.g., FMEA)

• Successfully completed studies in Physics, Chemistry, or a related scientific or engineering discipline
• Strong understanding of CMOS post-processing and wafer-level integration technologies (e.g. Through Silicon Vias, wafer-to-wafer bonding, die-to-wafer stacking, heterogeneous integration of different materials etc), with a focus on process module development and integration
• Proven team player with excellent collaboration skills
• Proficient in English, both written and spoken
• Clear and structured reporting style

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.