Job description

As a member of the EMM-based team, he/she is tasked with wafer level and package level IC test program development, IC characterization and qualification testing in the BU Automotive.

Note: this role does not offer any remote work possibility

Key responsibilities include, but are not limited to:

• Generation of full wafer level and package level IC test programs for evaluation and production
• Definition of IC test method and strategy.
• Structured and organized approach to developing and verifying IC functions and specifications
• Technical interface with EM design teams (local and remote)
• Product engineering for assigned ICs
• Support the BU technical leader in product test definition including technical analysis and test strategy
• Interface with Quality, Design Services, Fab, Back-End
• Interface with external customers when needed

Profile

For this role, the following profile is requested:

• Experience in all key aspects of digital and mixed signal IC test development at wafer and package levels, from test architecture definition to release to production testing
• Solid background in test concepts for high volume automotive products
• Experience in test hardware development and production tester functionality/operation.
• C (or C++) and script programming skills for test systems
• Strong motivation towards satisfying external customer requirements for automotive products

Professional requirements

• MS-level academic background, 5+ years of experience in relevant fields
• Ability to communicate with clarity and precision when interacting with internal and external groups
• Experience with Eagle ETS tester platforms
• Prior experience in automotive IC products a plus

Languages

• English at C-level is required (orally and in writing), fluency in French a strong plus