The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
Turning breakthrough technology into real products requires more than invention. It requires the precision to connect worlds that rarely meet: photonics, electronics, and advanced packaging working as one. Hybrid integration is where that convergence happens.

As our Senior Hybrid Integration Engineer (m/f/d) , your mission is to drive the integration of photodiodes and lasers into photonic integrated circuits (PICs) – from first concept through full validation. You will support fully packaged PICs with integrated components and contribute directly to shaping Q.ANT's technology roadmap. Through hands-on system bring-up, cross-functional collaboration, and close work with external partners, you translate cutting-edge opto-electronic designs into functioning, characterized assemblies that meet performance targets.

Your responsibilities

• Lead photodiode and laser integration projects on PICs across the full workflow: design, build, characterization, and validation.
• Perform hands-on PIC testing, optical alignment, and system bring-up, including signal readout and performance evaluation.
• Collaborate with photonics, electronics, and packaging teams; coordinate suppliers, service providers, and research partners.
• Ensure configuration control of process flows and maintain clear decision and action logs.
• Introduce automation strategies for characterization and propose new process trials based on results.
• Optimize integration yield and throughput; track KPIs including assembly yield, responsivity, TIA SNR, bandwidth, schedule adherence, cost per channel, and risks mitigated

Your profile

• Ph.D. in Electrical Engineering, Photonics, or a closely related field – or a Master's degree with at least 3 years of directly relevant industry or research experience.
• Deep technical understanding of photodiode and laser physics, TIA and driver design and characterization, and hybrid integration approaches.
• Proven hands-on experience with PIC testing, optical alignment, and system bring-up in a lab or production environment.
• Familiarity with photonic integration platforms such as LNOI, InP, or SiPh is a strong plus.
• Ability to balance complex electrical and optical trade-offs (responsivity, bandwidth, noise) and make well-reasoned design decisions independently.
• Fluent in English, German is a plus.