
Akhil Aithal
Fähigkeiten und Kenntnisse
Werdegang
Berufserfahrung von Akhil Aithal
- 3 Monate, Jan. 2025 - März 2025
Hilfswissenschaftler
Institute of Robust Power Semiconductor Systems
RF Microwave port Simulations using Keysight EMPro
- 1 Jahr, Jan. 2024 - Dez. 2024
Working Student – System Architecture
Robert Bosch GmbH, Abstatt
• Supported radar system architecture development with a focus on requirement tracking using IBM DOORS • Automated data extraction and analysis using Python and Splunk • Managed issue tracking and sprint activities via JIRA • Collaborated across teams to ensure seamless integration of system components
- 1 Jahr und 1 Monat, Dez. 2022 - Dez. 2023
Working Student - Hardware Engineer
Robert Bosch GmbH, Stuttgart
• Created and maintained hardware requirement documents using DOORS Next Generation • Assisted in lab testing and prepared test samples for validation • Provided hands-on support in debugging and prototyping of circuit boards
- 1 Jahr und 9 Monate, Jan. 2021 - Sep. 2022
Hardware Design Engineer
Bosch Global Software Technologies Pvt. Ltd.
• Developed electronic modules for Fuel Cell Electric Vehicle applications, focusing on Interlock, Low Voltage DC-DC converter, CAN, and crash signal interfaces • Performed end-to-end circuit design, simulation, and hardware testing • Automated testing workflows using Python and enhanced reporting via VBA scripting • Owned and managed module lifecycle including documentation and reviews • Coordinated procurement and improved component traceability and cost efficiency
- 2 Monate, Juni 2019 - Juli 2019
Hardware Engineer Intern
SunTrop Solar Pvt. Ltd.
• Contributed to wireless sensor network (WSN) development for agricultural applications • Supported design, integration, and bench testing of hardware prototypes • Collaborated in a small team, strengthening hands-on debugging and team coordination skills
Ausbildung von Akhil Aithal
- 2 Jahre und 6 Monate, Okt. 2022 - März 2025
Electrical Engineering
Universität Stuttgart
Major: Smart Systems Grade: 2.2 Research Project: Packaging of Integrated Circuits on Glass Substrates Master Thesis: Investigation of Modular Fabrication of Large-Area Passive RF Components
- 4 Jahre und 1 Monat, Aug. 2016 - Aug. 2020
Electronics and Instrumentation Engineering
BMS College of Engineering
Bachelor Thesis: Lightweight Indoor Mobility Solution CGPA: 8.87
Sprachen
Deutsch
Gut
Englisch
Muttersprache
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