Charles Percival

Project manager responsible for coordinating all design information related to development of PCB’s for testing IC and Wafer product. Primary liaison between customers, sales, manufacturing, vendors and PCB layout designers. PCB’s include designs for multiple test systems used for digital, analog (RF), mixed signal and memory product applications. Products range from 8 to 5000+ pins, single & multiple site devices with multiple packages and probe card types. PCB designs ranging from: BGA, PGA, QFP, SOIC, Ve

Project manager responsible for coordinating all design information related to development of Probe Card assemblies for semiconductor wafer product. Primary liaison between customers, sales, manufacturing, vendors and PCB layout designers. Probe Cards include designs for multiple test systems used for digital, analog (RF), mixed signal and memory product applications. Wafer products range from 8 to 2500+ pins, single & multiple site device probe cards. Probe assemblies used in various applications: Vertical

Design of custom probe cards for high performance Cascade Microtech probe membranes. Duties include customer, sales & manufacturing interface for all PCB related items. Design of probe cards from concept with considerations related to performance, manufacturability, assembly and component requirements. Used experience and test related knowledge to aid in design group development and training. Developed in-house verification fixtures to facilitate complete probe assembly test.

Project manager responsible for coordinating all design information related to development of PCB’s for testing IC and Wafer product. Primary liaison between customers, sales, manufacturing, vendors and PCB layout designers. PCB’s include designs for 100+ test systems used for digital, analog (RF), mixed signal and memory product applications. IC and wafer products range from 8 to 5000+ pins, single & multiple site devices with multiple packages and probe card types. PCB designs ranging from: BGA, PGA, QFP,

Primary functions included managing substrate designers coordinating designs with customers, product engineers, sales, simulation engineering, PCB suppliers and final assembly (factory) to create custom substrates. Additional duties included training team managers, champion customer projects, develop BGA product guidelines and specifications, interviewed potential new hire designers, participated in team to reduce overall product cycle times. Developed reports to monitoring design errors and cycle time. Cre

Project manager responsible for coordinating all design information related to development of PCB’s for testing IC product. Primary liaison between customers, sales, manufacturing and PCB layout designers. PCB’s included designs for 100+ test systems used for digital, analog, mixed signal and memory product applications. Customer products range from 8 to 2500+ pins, single & multiple site devices with multiple package types: BGA, PGA, QFP, SOIC, etc. Duties also included development, selection and purchase

Developed test hardware for IC and Wafer production test. Hardware included design of PCB’s, docking, IC handlers and other associated fixtures. Overall tasks accomplished through R&D program, presentation and implemented into production in both U.S. and overseas facilities. Hardware fixtures used across many product lines. Associated duties included maintenance of IC testers and handler systems: Teradyne, Sentry, Megatest (Teradyne), Hewlett Packard (Agilent/Verigy), MCT, Delta Design, Daymarc and more.

Assembled, tested and repaired servo system controllers for use with satellite earth stations, paper mills, auto dynos, etc. Duties included R&D work with engineers, field service work, supervising technicians and assemblers.

Assembled, tested and repaired servo system controllers for use with satellite earth stations.

Serviced Military Computers and associated equipment.