Dipl.-Ing. Erkan Cakmak

Process engineer in CMP and Wet Etch processing Equipment owner for front end planarization operations Group leader supervising production operations on shift to meet manufacturing goals supporting the production system in 2017 Quality champion leading the developent of quality standards in HVM environment Internal quality auditor for ISO9001 and IATF16949 completing the certification of the site in 2018 Project leader using Six Sigma methods for cost reduction and efficiency improvement

Research driven role in environment focused on equipment sales. Responsible for customer consultation and training, process development and improvement, equipment install and maintenance. Management and leadership of internal projects leading to peer reviewed journal publications and conference presentations. Consultation and guidance for junior engineers and leading role for peer engineers.

Worked in both R&D and customer support capacities by developing new technology and processes to solve manufacturing problems creating novel equipment processes. Conducted wafer demonstrations for both potential and existing customer application needs. Project Sampling: o Low-K film repair o Dry Etch Residue Removal in FEOL and BEOL o Photo resist strip for I-Line and deep UV for feature sizes as low as 35nm o Bevel etch / clean applications

Worked in a manufacturing environment, operating chemical vapor deposition equipment. Transferred product documentation (hard copy) into an online database with the quality department. Trained new employees on equipment operation, contributing to a highly productive and quality-focused team.

Developed an innovative process to remove dry etch residues from copper and low-K devices in close cooperation with the head of R&D Developed a highly controlled SiO2 wet etch removal process for wafer reclaim application

Evaluated the measurement feasibility of different oxide layers on various measurement tools. Assisted the production engineering team with the optimization of the deposition process

Notendurchschitt: 1,2 Schwerpunkt: Lean Six Sigma Black Belt

Abschlussnote: 1,5 Masterarbeit: “Aluminum Thermo Compression Bonding Characterization“

Zusatzqualifikationen:English for Industry and Commerce, Technischer Betrieb Diplomarbeit: “Evaluierung eines Messgerätes zur in-situ Messungen von Kupfer- und Eisen-Ionen gelöst in Chemikalien der Halbleiterindustrie“ Abschlussnote: 2,7