Ezgi Abacıoğlu

Optoelectronics - Photonic Terahertz Integration • Developed MUTC photodiodes based on InP/InGaAs with up to 500 GHz bandwidth and milliwatt THz output • Carried out fabrication steps including photolithography, ALD, CVD, RIE, wafer bonding, and chip testing • Simulated and optimized thermal and signal performance using MATLAB and Lumerical • Worked closely with industrial partners on packaging, integration, and thermal design - including SiC thermal interface concepts to manage high‑power densities

• Took ownership of reliability engineering, requirements, and system validation in defense‑related electro‑mechanical systems • Applied V‑model methods and lifecycle standards in system design and testing • Introduced DfMA principles to align design with manufacturing capabilities • Ran FMECA and Monte Carlo simulations under MIL‑STD reliability frameworks • Collaborated with internal departments and suppliers across all development phases Tools Used: DOORS, ENOVIA PLM, MATLAB, Oracle ERP, AutoCAD

Center for Solar Energy Research and Applications (GÜNAM) • Designed and produced one dimensional metal‐dielectric‐metal plasmonic nanowires for low‐loss waveguide and solar cell applications • Deposited highly conformal dielectric thin films on silver nanowires using atomic layer deposition (ALD) • Performed structural, optical and electrical characterization techniques at the nanoscale • Optimized titania and alumina ALD processes • Analyzed electric field confinement in multilayered plasmonic nanowires

Department of Metallurgical and Materials Engineering • Performed indium solder material electrochemical deposition on germanium windows for IR detectors • Optimized electrochemical bath parameters to obtain the desired microstructure for adhesive, mechanically reliable, and hermetic indium solders • Processed aluminum, nickel, and gold electrodeposition on conductive and non‐conductive surfaces with difficult geometries

GPA 3.79/4.00

GPA 3.23/4.00