Mohammad Zakir Alam
Angestellt, IC Packaging Design Engineer, Infineon Technologies AG, Munich
Munich, Deutschland
Werdegang
Berufserfahrung von Mohammad Zakir Alam
Bis heute 12 Jahre und 1 Monat, seit Juni 2012
IC Package Design Engineer
Infineon Technologies AG, Munich
-LeadFrame, BGA Package Design and Electrical Simulation -Parasitic Extraction, Signal and Power Integrity Simulation -LeadFrame Package Design Flow Development -3D Model Generation for LeadFrame Package -Support to LeadFrame Package Designer -Bug Investigation and Report to Vendor -Developed an AutoCAD plugin for Leadframe design flow development using VB.NET -Excel and Outlook Automation using VB.NET
Bis heute
IC Packaging Design Engineer
Infineon Technologies AG, Munich
8 Monate, Sep. 2011 - Apr. 2012
University Lecturer
East West University, Bangladesh
- Conduct Lecture on Telecommunication, Analog Circuit Design, AC Circuit Theory Course - Conduct Lab Course on Telecommunication, AC Circuit Course
6 Monate, März 2011 - Aug. 2011
Scientific Assistant
Advanced Integrated System Lab
-Single Stage Op-Amp Design in 130 nm CMOS Technology -Double Stage Op-Amp Design in 130 nm CMOS Technology -Folded Cascode Op-Amp Design and Layout in 130 nm CMOS Technology -VCO Design for 1MHz Application and Layout in 130 nm CMOS Technology
1 Jahr und 2 Monate, Jan. 2007 - Feb. 2008
Transmission Engineer
Banglalink
- PDH Link Design - Link Budget Prepare - Database Maintain - Tool: PathLoss
Ausbildung von Mohammad Zakir Alam
2 Jahre und 2 Monate, Apr. 2008 - Mai 2010
Master of Science (MSc)
University of Ulm
Microelectronics
5 Jahre und 1 Monat, Aug. 2001 - Aug. 2006
Bachelor of Science (BSc)
Bangladesh University of Engineering and Technology
Electrical and Electronics Engineering
Sprachen
Englisch
Fließend
Deutsch
Gut
Bangla
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