Dipl.-Ing. Shushanth MS Prabhu

Verantwortlich für die thermische Charakterisierung von Halbleitern mit FEM- und CFD-Tools. Bereitstellung von Simulationsunterstützung für verschiedene Semiconductor Familie z.B. TO292, Exposed Die pad packages, BGA, WFWLB . Bewertete thermische Parameter für Datenblätter sowie Kundengespräche. Prognostizierte JEDEC-Standardtemperaturwerte sowie Systemsimulation mit CAD-Geometrie, Leiterbahnen. Validierte FEM-Ergebnisse mit Labormessungen unter Verwendung von Thermoelement- und Infrarotmessungen.

Integral part of Whole Engine Thermals team of Rolls-Royce Deutschland GmbH, Germany • Performed thermal analysis on Engines for Small Business Jets BR710, BR725, BR700 NG, RB3043. • Predicted temperatures on rotating and non rotating components of the primary flow.

• Analyse the heat transfer behavior of Nacelle, Thrust Reverser and Nacelle Anti Ice system. • Predict steady state as well as transient temperatures for different components during different flight points and missions. • Support stress in providing thermal inputs for stress analysis. • Supported different programs such as Airbus A320neo, A350, Boeing 787, Mitsubishi Regional Jet, Bombardier C-Series.

• Integral part of Combustion and Casing, Rolls-Royce plc, UK • Performed thermal analysis for Large Civil Aircraft Engines. • Predicted temperatures on all non rotating components of the primary flow. • Supported different programs namely Trent 700, Trent 900, Trent 1000, Trent XWB.

• Thermal Power:-Established a transient measurement technique of thermal impedance network for validating thermal material properties of electronic packages in different thermal environments. • Power Cycling:-Responsible for a fundamental characterization of thermo-mechanical reliability of solder joint methodologies by researching current and previous approaches through peer reviewed publications and documenting key learning and next steps to improve reliability test processes.