kevin chai

- Lead ~20 FTE; define goals and key deliverable in line with company strategy to meet business objectives. Provide guidance to solve technical challenges. Prioritize tasks and manage resources to achieve KPI target - Laboratory operation and maintenance, FA equipment & technique evaluation, new FA method and technique development, work force training . - Responsible for 5S, ISO audit, workplace safety compliance. Review and plan Capex / Opex based on department’s expenditure and strategy.

- Transfer and ramp up 1st RG NAND product from US to SGP site as defectivity leader from PQE NPI; monitor and improve extrinsic DPM and intrinsic characteristics to meet application requirement of customer system. Determine root case of reliability fail and follow up implementation of CA by collaborating with PIE, PEE. - Key Achievements: Qualified 1st RG NAND Flash by improving defectivity DPM from 40k to 7k within 7 months. Built up platform and library for RG NAND wafer level reliability testing and FA.

- FA leader of Ambient Light Sensor project. Allocate FA resource to ensure project meet product-to-market road map. Conduct, oversee and guide EFA and PFA. Summarizing and presenting reports to customers for yield improvement. - Ensure team members completing projects efficiently and effectively. - Key Achievements: Successfully driven yield and qualification to meet project ramp up schedule. Systematically streamlined and shaped FA resource and organization based off project requirement.

- Monitor and analyze worldwide semiconductor industry market, technology, innovation, capacity trend. Compile strategy report and present to executive management to set long-term and short term company strategy. - Follow up the tape out, development as well as transfer of advanced tech-node for yield improvement and ramp up via co-working with TD and Foundry partners; propose Fab strategy of tech-node platform, application portfolio; update and promote promotion kits of various tech nodes to customers.

- Test and FA on imaging products (CIS camera, 3D projector, and ToF proximity sensor) received from R&D, production, RMA. Liaise with customers and internal departments for project yield ramp up, specification definition and qualification. - Develop testing methodology and failure analysis technique for newly taped out products. Coordinate and guide FA sub-contractor to identify failure root cause and product yield improvement. - Lab set-up including footprint planning, instruments procurement and hook up.

- FA on RMA CIS and camera module; compile and publish 8D reports. Perform EFA and PFA. Reverse engineering work on open market products. - Drive the improvement of yield, quality and reliability by collaborating with various top tier customers, foundries, OSAT. - Reviewing and ranking supplier quarterly by attending QBR meeting. - Key Achievements: Determined the RC of MP product fail and fixed the manufacturing process issue by co-working with foundry engineers ( Cu deposition due to machine problem).

- Test prototype wafer to build up FA method and database. Extract and analyze electrical parameters, yield of MPW and MP products. Identify the low yield issue by data mining, EFA, PFA. Drive implementation of CA. - Owner of product reliability and qualification. - Key Achievements: Fixed 65nm Logic product zero yield issue due to high leakage by design optimization; Improved Vmin of customized 65nm SRAM from 0.9mv to 0.78mv, and yield from 60% to 90%. Qualified 65nm and 45nm prototype products timely.

- Product yield improvement, test parameter analysis and FA. Drive FAB to implement CAPA. DRC of new product GDS layout. Introduce and ramp up TD product. - Start-up new machine for production; develop and set up new etch recipes. Reduce production defective; optimize recipes for throughput improvement. Monitor SPC to react if OOC or OOS. Team leader. - Achievements: Successfully improved yield of 0.16LG from 75% to 91% , 0.18 CIS from 70% to 92%; Successfully set up robust etch recipes for new products.