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Company Description

Since 2014 we have been working on the development of innovative products based on NFC tech-nology, consisting of hardware and software. We are part of the RENESAS family and well embedded in the Embedded Processing and Connectivity organization.

To date we have successfully launched multiple NFC ICs onto the market. Our NFC products are used for example in Point of Sales terminals, wireless charging of wearables (like small battery accessories or smart watches) and in the field of Internet of Things (IoT). The innovative strength of our interna-tional team is visible in our day-to-day work and the products we bring to the market.

Renesas Electronics Corporation is a dynamic organization that you will be part of and as such you will be helping to address the rising demand of NFC in applications such as Fintec, IOT, asset tracking, wireless charging and automotive applications.

Job Description

We are seeking a highly organized and technically skilled person with a deep understanding of En-gineering processes and Configuration Management to support our semiconductor development programs and ensure traceability across the entire product lifecycle. This role will focus on optimiz-ing engineering processes, reporting, and collaboration using Jira and Confluence, ensuring align-ment across cross-functional engineering, design, and manufacturing teams. Your role is essential to ensure that every work product - from Mixed-Signal design files and Digital RTL to Post-Silicon validation reports - is version-controlled and cross-referenced. You ensure that a bug found in the lab can be traced back to the exact design baseline and verification testbench that produced it.

KEY RESPONSIBILITIES

• Full-Lifecycle Traceability: Enable and maintain the link between requirements, pre-silicon verification (Simulations/Emulation), and Post-Silicon validation results.

• Mixed-Signal Change Control: Govern Engineering Change Orders (ECOs) that affect both Analog layouts and Digital logic, ensuring all Work Products are synchronized before tape-out.

• Post-Silicon Governance: Manage the configuration of Validation Boards, firmware versions, and test scripts used in the lab to ensure reproducibility of results.

• Standardize project templates and workflows: Ensure consistency across ASIC, SoC, and IP development programs.

• Support compliance: Ensure we meet internal and external quality standards (e.g., ISO, au-tomotive ASPICE).

• Release Artifact Management: Organize and secure all final deliverables, including GDSII, BOMs, test vectors, and compliance documentation.

• Requirements Management: Support the team and ensure that requirements are well doc-umented and tracked across the product lifecycle

• Continuous Audit: Conduct technical audits to ensure that the IC being tested matches the "as-built" digital configuration stored in the CMS (Configuration Management System

Qualifications

PROFESSIONAL BACKGROUND AND SKILLS

• Holistic Data Management: Expert use of version control systems (e.g., Git/subversion/Clio-Soft) for both large binary analog data and text-based verification scripts.

• Lifecycle Tools: Proficiency in Product/Application Lifecycle Management (PLM/ALM) tools to manage the "Digital Thread" from spec to silicon.

• Verification Knowledge: Familiarity with pre-silicon verification environments and how they relate to post-silicon lab measurements.

• Change Governance: Deep understanding of Change Control Board (CCB) workflows and impact analysis in a high-stakes semiconductor environment.

• Semiconductor Industry: A very solid knowledge of semiconductor development processes and manufacturing is a must-have.

• Education: Master in Electrical Engineering, Systems Engineering, or a related technical dis-cipline.

• Experience: 4+ years in CCM or Quality Engineering, specifically within the Semiconduc-tor or High-Tech Hardware sectors.

• Strong skills in data visualization and reporting (e.g., Jira dashboards, Power BI).

• Excellent communication and stakeholder management skills.

Additional Information

This position is subject to the Collective Agreement of the Electrical and Electronics Industry, employment group H (https://www.feei.at/leistungen/informations-service/mindestlohne-und-ge…). The monthly salary is paid 14 times a year. However, we offer a higher salary depending on your experience and qualifications.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.