Master thesis-Investigation of Bosch-Process to Maximize Robustness & Full-wafer Uniformity (m/f/d)
Master thesis-Investigation of Bosch-Process to Maximize Robustness & Full-wafer Uniformity (m/f/d)
Master thesis-Investigation of Bosch-Process to Maximize Robustness & Full-wafer Uniformity (m/f/d)
Master thesis-Investigation of Bosch-Process to Maximize Robustness & Full-wafer Uniformity (m/f/d)
ams-OSRAM AG
Halbleiter, elektronische Bauteile
Premstätten bei Vasoldsberg
- Art der Beschäftigung: Vollzeit
- Vor Ort
- Aktiv auf der Suche
Master thesis-Investigation of Bosch-Process to Maximize Robustness & Full-wafer Uniformity (m/f/d)
Über diesen Job
Premstätten, Styria, Austria – ams-OSRAM AG
Your tasks
• Literature Review
o Comprehensive literature review of Bosch Process principles, critical parameters and their influence on full wafer uniformity.
o Comprehensive literature review on BMD (oxygen precipitates, vacancy/interstitial mechanisms) and known defect interactions during the Bosch DRIE process.
o Overview of recent trends and research interests in Bosch-process technologies.
• Experimental Work and Analysis
o Characterization of the current state of selected production equipment in regards of Silicon etch rate uniformity, deposition o Characterization of the current state of selected DRIE production equipment in regards of Silicon etch rate uniformity, deposition uniformity, breakthrough-etch uniformity and overall Bosch-process etch rate uniformity on full-wafer-uniformity basis.
o Characterization of Silicon etch rate uniformity, deposition uniformity, breakthrough-etch uniformity as a function of TSV depth.
o Characterization of starting wafer material: identification of type, size, density, and radial distribution of BMDs using LST/FTIR as the primary method, with TEM/FIB-SEM verification on selected sites.
o Probing the individual Bosch-Process steps for robustness and optimization of uniformity in a Design of Experiment setting.
o Set-up of an optimized Bosch process sequence with improved full wafer uniformity.
Objectives
o Identify the main factors responsible for non-uniformity effects close to the wafer edge.
o Determine type, size, density, and variation of BMDs in our starting material.
o Provide a model for predicting cycle-by-cycle progression of non-uniformity in regards of full-wafer uniformity and TSV depth.
o Develop a characterization procedure for full-wafer uniformity which allows to correlate electrical parameters to tool parameters.
Who we are looking for
• Ongoing Master’s studies in Materials Science, Chemistry, Chemical Engineering, Physics, or related fields.
• Knowledge of Design of Experiment (DoE) is an advantage.
• Ability for swift and determined execution of experimental tasks since the work will be carried out on a critical production tool.
• Experience of data processing and data visualization.
• Experience of working in a cleanroom environment is highly appreciated.
• Independent, structured, and analytical working style.
• Ability to report experimental results clearly and unambiguously to different audiences with the respective technical details required.
• Proficiency in English (written and spoken).
We offer competitive salaries and additional benefits based on your performance, experience, and qualifications. Employment is in accordance with the collective agreement for the electrical and electronics industry, employment group E (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
Phone:+43 3136 500 32853
E-Mail:marlies.nigitz@ams-osram.com
Job details
2026/02/04Unternehmens-Details
ams-OSRAM AG
Halbleiter, elektronische Bauteile
10.001 oder mehr Mitarbeitende