The future of AI computing is light, not electrons.
At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing.
As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology.


Your Impact & Responsibilities

• Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)
• Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation
• Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques
• Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)
• Execute thermal management strategies for high-power photonic and
  high-frequency devices
• Establish quality assurance and verification protocols to achieve ≥95%
  first-pass qualification on supplier-delivered modules
• Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP
• Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture