Dipl.-Ing. Dante Bonanni

Responsible for semiconductors and OSAT for outsourced processes (plating and final assembky) from NPI initial setup (SPC, Control Plan, FMEA, quality requirements and material analysis and disposition) to audit and monitoring during HVM (periodic yield review, improvement actions, quality issues 8D review and actions implementation).

Back End Lithography processes, process responsible for new products release in production. Process control and improvement, quality interface with customer for Lithography failure, troubleshooting, definition of corrective and preventive actions. Process monitoring definition and improvement.

Permanent Wafer Bond process ownership: prcess development, customer support for process failure, process improvement, documentation of process development and definition of wafers preparation. Equipment ownership: partecipate to continuous improvement projects, customer support for machine installation, setup and troubleshooting. Customer management. FMEA and SPC introduction in the company.

Diffusion and CMP department, 1 year experience as team leader, 6 months experience as SPC coordinator. Experience in process and production control, process control and improvement, product quality monitoring, equipment performance monitoring and optimization.

Solid state Physics, MIcroelectronics device design and testing, Production proceeses, Data Analysis.

Digital and Analogic Electronics, Microelectronics, Automated Controls, Computer Science.