Deepak Dayanand

Topic: Characterization of the Junction Temperature of a Silicon Carbide Power MOSFET Using Temperature Sensitive Electrical Parameters Grade: 1.0 • AIM: To measure the junction temperature without external sensors • Static and dynamic characterization using double pulse-tests • Circuit design, simulation, schematic creation, PCB layout design for data acquisition, Gate Driver & Microcontroller interface • Novel idea implemented on PCB prototype and the results obtained are presented in APEC 2020

• Development of system integration tests for vehicle instrument clusters with a focus on HW-SW interface test to ensure functional safety

• Hardware development for powertrain control units • Functional hardware/electrical tests to meet automotive electrical standards • Authored test plans, test reports and release documents • Collaboration and communication on design reviews, failure analysis, problem solving • Automated tests system development • Support for new platform, module and product development teams

• Seminar Topic: Characterization of intrinsic parasitic elements of a Power MOSFET • Electronic Circuits, Radio Frequency Technology, Intelligent Sensors and Actors, Physical Design of Integrated Circuits, Hardware Verification and Quality Assessment, Embedded Systems Engineering