Dmitrii Kruglov

• Led EM & EM-thermal simulation methodology development across business units • Supported Ansys HFSS, Icepak, Q3D, Maxwell; integrated with HPC & SPDM • Consulted on radar, antenna, IC package electro-thermal analysis • Led 3-person wireless prototype team (concept to demo) • Collaborated with EDA vendors; integrated PyAEDT into HPC (10x+ gains) • Mentored master’s students Tools: HFSS, Icepak, Q3D, RedHawk SC, PyAEDT

• Drove adoption of 3D EM simulation for “first time right” IC & SiP design • Led mm-wave antenna-in-package design: chip-package transition, array integration • Completed mm-wave SiGe circuit design cycle (concept to lab test) • Benchmarked EM tools vs. on-wafer data to improve correlation • Consulted on EM modeling; advised on patent eligibility for 4 RF/mm-wave designs Tools: HFSS, ADS, Virtuoso, MATLAB

• Researched mm-wave on-chip antennas; developed novel contactless OTA characterization method • Designed, simulated, and taped out GaAs mm-wave antennas • First author: IEEE AWPL article, 2 international conference papers • Co-authored 6G white paper; filed Swedish patent on mm-wave antenna techniques • Performed antenna measurements (anechoic & on-wafer) • Taught “Linear Systems & Filters” (100+ students) and parts of “Antenna Engineering” Tools: HFSS, CST, MATLAB, Python, ADS