Hing Nan Cheng

A senior executive leading the organization to weather through the current financial crisis, and to turn it around in the next 9 - 12 months.

_________________________________________________ Business Development for Asia Pacific. Grew by 24% (to US$243M) and built Design In pipeline > US$800M __________________________________________________ New Product Introduction (NPI) _________________________________________________ Product and pricing strategy (direct and through channels) _________________________________________________ Sales enablement _________________________________________________ MarComm (PR, Ads, Web, Events, etc.)

________________________________________________ Increased indigenous OEM sales from US$15 million to US$32 million ________________________________________________ Product responsible – Foundry, ASIC, PowerPC, Technology design services, Network Processor, STB chips ________________________________________________ Achieved US$160 million design-in Life-Time revenue in Y2003 ________________________________________________ Established strategic account plan to achieve US$200 million in Y2006

- Increased regional sales from US$350 million to US$401 million in Y2002 - Achieved US$92 million, US$152 million and US$181million sales in1997, 1998 and 1999 respectively - Product responsible – Memory products (DRAM, SRAM), x86 CPU, Foundry, ASIC, ASSP, interconnect (packaging), PCBs.

- Developed 3 models including low cost Mac for WW and AP market. - Responsible for product development, mass production and EOL management. - Managed a cross functional team consisting of Design, Manufacturing, Testing, Quality, Reliability, Document Control, Finance, Planning and Procurement.

- Responsible for US$240 million worth of system outsourcing, including Mac and 14” - 15” monitor. - Seeking reliable and competitive subcontractors in this AP region. - Developed and implemented outsourcing procedures in compliance to ISO 9000 quality management

- Responsible for US$12 million worth of ECAT/PCBA procurement. - Implemented EDI tool for graphics interchange to enhance Turn-Around-Time and product quality. - Trained by IBM Buyer School, negotiation skill, 6 sigma quality system, SPC and ISO9000 quality system.

- Responsible for Test process and diagnostic program development for PC, Floppy Disk and Hard Disk manufacturing. - Storage business acquired by Western Digital, but join Tandon to set-up Procurement office in Singapore.

Business Administration Finance Business Management Information Technology Management Business Strategy

Computer Engineering