Kumar Rajeev Ranjan

Angestellt, Embedded Systems Engineer, MOIA
Berlin, Germany

Fähigkeiten und Kenntnisse

Embedded Systems
Linux
Yocto
OpenEmbedded
C++
V2X
Mobile Devices
GSM
C Programming
System C
Telecommunications
Computer Architecture
LTE
Embedded Linux
Algorithm
Matlab

Werdegang

Berufserfahrung von Kumar Rajeev Ranjan

  • Current 3 years and 7 months, since Nov 2022

    Embedded Systems Engineer

    MOIA
  • 2 years and 8 months, Feb 2020 - Sep 2022

    Senior Embedded Engineer

    unu GmbH
  • 6 months, Jul 2019 - Dec 2019

    Senior Embedded Software Engineer

    Hangsheng Technology GmbH

    Responsible for the design and implementation of software components in an agile environment. • Actively involved in design decisions and implementation of software components • Backlog grooming, sprint planning and coordination of software development • Development of application framework for V2X solutions • An active member of Car-2-Car Consortium for working group - CG Security

  • 2 years and 6 months, Jan 2017 - Jun 2019

    Embedded Software Engineer

    Hangsheng Technology GmbH

    • Responsible for design and implementation of software components and its integration in yocto • Configuring kernel, u-boot and integrating/porting drivers to enable/disable • Evaluating 3rd party software solutions for various applications and their integration • Preparing development infrastructure for development, continuous integration and quality compliance • Developing release management and baselining of software components for delivery

  • 5 months, May 2016 - Sep 2016

    Software Devloper Intern

    Intel Deutschland GmbH

    • Requirement analysis and tracking of top 100 important modem features, bands and CA requirement for Tier 1 operators and its validation • Managing and coordinating other interns for tool development, coordination among content provider, tool users and updating tool with latest information

  • 7 months, Oct 2015 - Apr 2016

    Master Thesis Student

    Intel Deutschland GmbH

    Thesis Topic: Dynamic Power Analysis using Virtual Prototype The thesis aims to develop a system level power model for a baseband processor of a mobile SoC for early power debug and analysis • Create monitor module for tracing power related information for processor core and peripherals • Compare and correlate the simulated power against existing silicon measurements • Create a graphical output (GUI) for displaying the current values over time

  • 1 year and 4 months, Jun 2014 - Sep 2015

    Werkstudent - Software Developer

    Intel Deutschland GmbH

    Tool development for tracking modem features (Tool Name: Top100) - Tracking of more than 100 key modem features of OEMs, operators, network vendors and chipset manufacturers - Various access right and security implementation to protect data and tool Data Flow Model for GNSS Module - Implementation of data flow model for GNSS Module of platform SoC written in C

  • 1 year and 11 months, Aug 2011 - Jun 2013

    Engineer - Core Networks

    Ericsson India Pvt. Limited

    Job Role: Design, Audit and Optimization of Core Networks Project #1 Network Audit and Optimization - End to End Analysis of Call Setup time and its benchmarking - Analysis of Key Performance Indexes of Core Nodes and Radio Networks Project #2 Network Design and Planning - Preparation of Detailed Level Design of Media-Gateway - Study and analysis of migration impact in Core Network during deployment

Ausbildung von Kumar Rajeev Ranjan

  • 2 years and 7 months, Oct 2013 - Apr 2016

    Communications Engineering

    Technische Universität München

    Electronic Design Automation, Advanced Topics in IC Design , Multimedia Communications, High Speed Digital CMOS Circuits, Chip Multicore Processors, System-on-Chip Platforms, Broadband Communication Networks, Embedded Systems and Security

  • 3 years and 10 months, Aug 2007 - May 2011

    Electronics and Communication Engineering

    National Institute of Technology, Hamirpur

    Digital Electronics and Logic Design, Engineering Mathematics, Electrical Circuit Theory Data Structure, Communication Theory, Advance Digital Communication, Data Communication and Networks Digital Signal Processing, VLSI Design Techniques

Sprachen

  • English

    C1 (Fließend)

  • German

    A1-A2 (Grundkenntnisse)

  • Hindi

  • Nepali

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