Dr. Manuel Stompe

Team Lead Precision Automation Equipment Semiconductor Back-End Direct integration of novel control, heating solutions and high precision motion system in product line equipment. Technical lead of innovation, market Analysis and technology Roadmap Definition in precision backend moduls.

Led development of precision motion subsystems for semiconductor packaging equipment, improving positioning accuracy and system robustness. Development and deployment of <5 Micron PCBA Moduls. Short-Stroke precision Scanner with <100 Nanometer positioning Accuracy. Development of advanced heating solution for small and big Die Bonding Thermocompression and Eutectic Prozesses. Force controlled motion Pick-and-Place and Bonding moduls with ACS Motion drives.

Design, development and ramp up of a largs scale (up to 5m2) flat bed machine system for large area electrical light panels. Multi module head with 1k, 2k dispesing, high frequency milling Spindel, area hight inspection, hot bar soldering and THK pick and place Module integraded. Dual CFRP gantry for increased machine yield on Multi-process machine Layout.

Development and testing of EUV mirror Systems for actuated facett mirror module in EUV High NA Systems including patent. System Design and Material selection for Ultra high vacuum applications. Parametric CAD Design in PTC Creo for increased Design speed and early Design decission making. Automated SAP PLM based data Dimensiom Analysis for early stage Part cleaning equipment planning (1 year earlier supply chain readiness).

Sales, Service, Process Development