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Muhammad Hussain

Abschluss: Masters, Technische Universitat Chemntiz , Germany
Chemnitz, Deutschland

Fähigkeiten und Kenntnisse

Atomic Force Microscopy
Pico view
WSxM5.0 (Windows Scanning Microscope software)
Defectivity analysis
Ansys
Yield Manager(YM)
Defect Feedback System (DFS)
Space
Wafer defect Pareto's
Semiconductor wafer defect
SEM Images wafer defect classification & analysis
Heidenhain Adhesive thickness measurement
SAP
NIKON Eclipse L200 Microscope
Chip bonding
Bond Aligner Suss BA8
chip bonder Tresky T-3002-FC3
Hewlett Packard RLC-meter
Team viewer7 & 8
Huawei M2000 i-Manager
Local Maintenance Terminal (LMT)
Hewlett-Packard-TeMIP
Hewlett-Packard-OVSD
Troubleshooting
Alarm Management
High Frequency Structure Simulator
Huawei
Alcatel and Motorola Operations Maintenance Center
AutoCAD
Office Automation
Microsoft Windows
Microsoft Outlook
Internet Utilities

Werdegang

Berufserfahrung von Muhammad Hussain

  • 9 Monate, Jan. 2016 - Sep. 2016

    International Scholar

    IMEC

  • 8 Monate, Juni 2013 - Jan. 2014

    Master's Student Employee (Wafer Contamination Free Manufacturing dept)

    GLOBALFOUNDRIES

    Department of Contamination Free Manufacturing  Reviewed the Scanning Electron Microscope images on unstructured test wafers for various groups  Developed defective Pareto's per tool group  Classified and sub-classified the defects of test wafers  Documented the results from Yield Manager and Space in Defect feedback System  Analyzed the root cause of the defects with possible equipment problems with module engineers and task force team

  • 5 Monate, Apr. 2013 - Aug. 2013

    Research Assistant

    Fraunhofer ENAS

    Department of System Packaging  Research on lead free and lead containing low melting temperature type solders for the Design and Bonding Technology of MEMS  Literature research on the subject of whisker formation in lead free solders  Characterization of microchips in the ENAS clean room environment under supervision of research scientist

  • 1 Jahr und 2 Monate, Mai 2011 - Juni 2012

    System Support Engineer

    GLOBAL Intelligent Solutions Lahore, Pakistan

     Provide 1st level support  Identify and resolve routine operational systems problems.  Provide assistance as required to desktop support and network team  Administer and troubleshoot company computers, software, peripherals, and general connectivity.  Handle the analysis and resolution of issue/problem(s) in a timely manner, documenting and escalating unsolved issue/problem(s) to the higher level as necessary.  Other duties as assigned.

  • 10 Monate, Apr. 2010 - Jan. 2011

    Network Operations Centre Supervision Engineer

    Mobilink GSM Lahore, Pk

     Network Monitoring  Hands on experience on Alcatel, Motorola & Huawei OMC-R’s with effective monitoring and minimizing down time of nation wide network  Fault-management of GSM access network via OMC-R consoles of Alcatel, Motorola, & Huawei (i-Manager M2000 Mobile Element Management System & BSC6000 Local Maintenance Terminal)  Other duties as assigned

  • 1 Jahr und 1 Monat, März 2009 - März 2010

    Electrical engineer

    MASSC

     Provide technical direction during installation.  Assists in troubleshooting problems.  Assists in the planning and completion projects.  Providing information to co-workers, and subordinates by telephone, in written form, e-mail, or in person.  Process problem identification and resolution.

Ausbildung von Muhammad Hussain

  • 3 Jahre und 10 Monate, Okt. 2012 - Juli 2016

    Micro and Nano Systems

    Technische Universitat Chemntiz , Germany

  • 4 Jahre und 1 Monat, Feb. 2005 - Feb. 2009

    Electrical Engineering

    COMSATS Institute of Information Technology Lahore Pakistan

  • 2 Jahre und 1 Monat, Okt. 2002 - Okt. 2004

    Pre-engineering

    Post Graduate College Bahawalpur, Pakistan

    Science

  • 2000 - 2002

    Army Public School and College, Bahawalpur Pakistan

    Science

Sprachen

  • Englisch

    Muttersprache

  • Deutsch

    Gut

  • Arabisch

    Grundlagen

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