Safak Kececi

Head of Department at Backend Regensburg. Responsible for Process Integration & Product Engineering of Wafer Level and Sensor Products for Automotive, Industrial and Consumer Applications; Chipcard Assembly and Preassembly Processes; High Power Module Solutions for Hybrid and Electric Mobility.

Head of Department in Chip Embedding Segment, Backend Regensburg. Responsible for Process Integration & Product Engineering (Wafer Level and Chip Embedding Technologies) and Technology Transfer & Synchronization to Subcontactors

Transfer of eWLB technology and process variants to subcontactor; ramp-up and sustaining of the eWLB technology in worldwide production lines of subcontractors Head of process integration

Projectleader "Baseline-Defect Density", Coordination Macroinspection Activities within Frontend Fabs; Head of Zero-Defect Subproject " Waferinspections",

Harmonization of inspection methods and common strategy within production sites in Europe; Planning and implementation of metrology in Asian production site (Kulim-Malaysia)

Conception, construction, coordination and management of modules in process integration

Microcontroler, Fingertip Sensor

Department Manager

Coordination Fotolithography & Plasmaetching

Photolithography Production

Cleanroom Technology and Waferinspection Systems

Production