Suhitha Dandu

Design and development of multilayered PCB for high-speed, high-voltage, power applications taking into account EMC and IPC guidelines. Experienced in defining and updating the constraints manager and documentation: ODB++, Gerber data, pick and place file, BOM, assembly drawings, layout reviews and order. Tools: Mentor Graphics V.X.2.4 and V.X. 2.7.

* Responsible for the development of multi-layered printed circuit boards (PCB) to establish and control wireless communications over two or more devices. * Adept in end-to-end developments from requirement analysis to component selection and sourcing, testing components, schematic circuit design, board layout, design rule check (DRC), testing and documentation of the product. * Actively involved with communication protocols like SPI, UART and RS-232.

* Development of a loosely coupled framework to establish and control communication in a network using the publish/subscribe paradigm. This framework provides an integrated solution for real-time and reliable intercommunications, emphasizing the importance of communication entities in industry 4.0. * Efficient with development and modelling of network connections and establishing communication over the network using various concepts from networking and communication protocols.

* Measurement, Evaluation and preparation of temperature sensor data from a selective laser melting stage to find indications of defects on printed structures.

* Extract creation for the commercial customer data for data analytics and Customer data base consolidation using SAP BO Data Sciences and Structured Query Language.

-Automated test and measurement -Communication systems -Computer Networks -Distributed Systems -Embedded Systems -Introduction to hardware design -Measurement and Instrumentation -Microsystems