Tom Gao

 Responsible for AMD CPU and APU product ATE test program development, and provide daily engineering support for global foundry and ATE test house.  Drive foundry process improvements, process changes, retargeting to improve test yield, performance, variation.  Work with cross functional team to allocate yield improvement opportunity, drive for ATE/SLT/OSAT yield/process improvement.  Manage product ramp to yield entitlement. Drive margin issues with operations and development teams.

 Developing ATE test code for 3D NAND product in Intel Fab68 foundry as test lead. (Data Centre and Cloud BU)  Initiate and lead cross-functional teams, develop and drive to meet project deadlines, and solve difficult technical problems with creative thinking.  Developing and maintaining wafer level functional test strategies and programs.

 Lead test/product engineers to develop NPI and production test program for customer ICs, Optimize yields, test coverage, test time reduction, handle customer return and implement special customer screen tests by working with failure analysis, yield enhancement, production and marketing engineers.  Manage a larger department of engineering group; take full responsibility for 42 different customers and 610 multiple products, maximizing productivity and sales, improve quality, drive for KPI and results.

 Leading TE team to support engineering activity and issues resolving, meet units cost, productivity, quality goals, deliver to the committed KPI and product AOP roadmap.  Develop new product and program on Advantest T2000 C++, Verigy 93k, LTX credence sapphire java platform for new customer and new demand, Subcon/fab enablement to built production capacity.

 Design ATE test system, test solution and test program according customer requirements and JEDEC standard. (write/create test program on Advantest T2000 SOC test platform and T5593/5585 DRAM test platform)  Project management for new product SQ qualification, DCTC characterization and get DRAM DCTC approval and validation from Intel, organize and transfer new product from Munich Germany to Suzhou according qualification plan.

 Leading RF (Radio Frequency) ATE testing team, team work to improve KPI (FPY, RLIP, Hold Rate, Output, Utilization, MTBBF, maintenance uptime, etc.).  Leading baseband audio Mix signal ATE testing group, find out low cost solution for mix signal chip testing, equipment supplier management, control supplier contract usage, cost saving.