Anu Paul

Test and Certification engineer in Electromagnetic Compatibility (EMC)

Analysis of bonding techniques for transparent polymer substrates for printed systems: Multi layer printed system provides a platform for thin large area mechatronic units that can comprise electronic but also sensory and optical elements. The thesis deals with the analysis of different bonding techniques regarding their suitability to bond thin transparent PET foil substrates comprising printed conductive lines.

Plan and coordinate production engineering processes on daily basis to produce high quality products. Develop process improvements to effectively utilize equipment and materials to maximize production. Stay current with product specifications, engineering technologies and production processes.

Successfully completed project for the Automation of 85contact relay staking and bending at OEN India limited Kochi. 85 Relay is generally used in Automotives. The staking and bending process of moving coil armature is automated by this project using 8085 microcontroller.

Physical sensors, Optofluidic sensor systems, Environmental sensors, Chemical and Bio sensors, Automotive sensors applications

Sensors and signal processing, Micro Electro Mechanical Systems, Automotive Electronics, Hydraulics and Pneumatics, Medical Mechatronics.