Dipl.-Ing. Bernd Hochmuth

Full stack, open banking. PSD2, Java 11, Spring/Spring Boot, OpenApi 3.0, SQL/Hibernate/MySql/AWS Aurora, Gradle, Maven, Typescript, Javascript, Node.js, Express.js, AWS, Angular, Docker, Groovy, Jenkins pipelines & libraries, Python

Intel acquired Infineon's mobile phone devision in 2011. Responsibilities: Various developer/architect/technical lead/project lead development tools subdomain, e.g.: - developer and product owner (SCRUM) Eclipse RCP cross platform tools - introduction of agile development, pilot team, SCRUM, extreme programming, test driven development, continuous integration - cross function team lead development tools mobile platform projects - various coordinating roles tool domain

Infineon acquired LSI's mobile phone division in 2007. Responsibilies: Platform integration for lead customer in Korea. Various developer/architect/technical lead/project lead development tools subdomain, e.g. - Technical lead/feature lead of a cross side tool development team (Germany/Denmark/Singapore) - roll out V-modell to tool domain - architecture and project lead for tools deployment and update infrastructure and for a remote object management subsystem for mobile phone devices

LSI acquired Agere in 2007.

GSM/GPRS/EDGE/UMTS Mobile Phone Platform development, SW platform for mobile phone platforms. Responsibilities: - SW development (Ansi C) - platform integration for internal UMTS (multicore) platforms and customer phones - SW component responsibility Non Volatile Storage and Production & Test SW framework

UMTS protocol stack development. After insolvency consulting for mobile phone development. Responsibilities: - customer platform integration of UMTS protocol stack - UMTS layer 1 simulatior development (C/C++) - UMTS layer 1 SW development at customer site (France) - vendor and operator IoT for UMTS mobile phones

(Assignment followed internship and diploma thesis). Development of powerline modems. Reponsibilities: - ISO OSI layer 2 network protocol design for powerline modems - MATLAB simulation and power grid measurements - DSP SW development (Assembler, C/C++) - Windows device driver design, planning and coordination with external supplier from India - on site development/customer platform integration in Hitachi City, Japan

RF & Communications Engineering