Dr. Christian Schlünder

Qualification-Team Head, Quality Assurance / Management; Post silicon Qualification of IP Components as Embedded Memories (SRAMs, ROMs, OTPs, eFuses, etc.) of in-house Technologies, newest Silicon Foundry Technologies and 3rd party IPs; IP Qualification Methodology, HTOL Methodology, Circuit Reliability Research, Circuit Aging Simulation and Modelling, Transistor Aging and Variability Research, Supervisor for (PhD) Students; Department: Design Enablement and Services / Silicon Verification & Qualification

Quality Managment, Quality Assurance, Core-team member technology; Qualification of in-house and Silicon Foundry CMOS & smart power technologies for industrial and automotive applications; Front End Reliability Research, Circuit Reliability Research, Aging Simulation, Design for Reliability; Department: Operations / Quality Managment / Reliability

Front End Technology Qualifications of in-house and Silicon Foundry Technologies; Front End Reliability Research; MOSFET Aging; Department: Enabling Technologies & Services / Reliability

Device Reliability Qualifications / Device Reliability Research; NBTI and HCS modelling; Department: Corporate Logic / Technical Services / Reliability Methodology

Corporate Research Department (CPR), Microelectronic; HCS and NBTI device reliability research, Mixed Signal Applications

Forschungsarbeiten im Bereich Halbleiterzuverlässigkeit von aktiven Bauelementen; speziell Hot Carrier Stress in Digital- und Mixed Signal Applikationen (HCS, BTS, NBTI); Diploma Thesis: "Degradations- und Relaxationsmechanismen in p-MOS Transistoren nach "Bias Temperature Stress"; Dept.: Central Research Labs (Zentralabteilung Technik Mikrolektronik)

doctorate accompanying to his regular work at Infineon Technologies; Doctoral thesis: "Zuverlässigkeit von sub-µm-CMOS Schaltungen bei Bias-Temperature-Stress (BTS)"

Focus: Mikroelektronics