
Dr. Daniel Farley
Fähigkeiten und Kenntnisse
Werdegang
Berufserfahrung von Daniel Farley
- 1 Jahr und 9 Monate, März 2019 - Nov. 2020
Package Development Engineer
ON Semiconductor
- 2 Jahre und 1 Monat, Nov. 2012 - Nov. 2014
R&D Engineer
Allseas
Small equipment development; including design, test, and improvement of new and existing machinery.
Specialist in Electronics Reliability assessment for SSL systems, assisting in the establishment of the TU/Delft BRC (Beijing Research Consortium) for SSL and LED Lighting. Lab manager for the inaugural Micro/Nano System Integration and Reliability Research Group.
- 8 Jahre und 1 Monat, Aug. 2002 - Aug. 2010
Researcher
University of Maryland, CALCE
Electronics packaging reliability assessment, overstress limit characterization, accelerated life testing, virtual testing & qualification, durability assessments, industry interaction.
- 3 Monate, Jan. 2006 - März 2006
Research Intern
Philips Applied Technologies
Package reliability studies, product testing simulations, shipping durability studies, accelerated test data analysis and interpretation.
- 6 Monate, März 2003 - Aug. 2003
Research Intern
Dell
Durability testing design and setup, equipment development, LabView programming, interdepartmental communications and data collection, fatigue model analysis and interpretation.
- 1 Jahr und 5 Monate, Feb. 2001 - Juni 2002
Project Engineer
UOP LLC
Structural Design-includes drafting in AutoCAD & material selection; project coordination and all mechanical/structural engineering responsibilities, supervision of drafters.
- 7 Monate, Aug. 2000 - Feb. 2001
Design Engineer
Aurora Systems, Inc
Implemented and analyzed simple and complex structural beam configurations serving as crane runways and headers utilizing ANSYS & Beam Theory, design and drafting of stacker crane structures, transfer of 2-D AutoCAD drawings to 3-D AutoCAD models. (Company went out of business.)
- 11 Monate, Okt. 1999 - Aug. 2000
Product Engineer
New Venture Gear
Pressure-Velocity Constant (PV) design for the T850, T750, and T350 Transaxle speed gears, data collection, organization, and testing of data from prototype, reorganization of the component tracking system.
Ausbildung von Daniel Farley
- 8 Jahre und 5 Monate, Aug. 2002 - Dez. 2010
Electronics Packaging
University of Maryland College Park
Mechanics of Electronics, Finite Element Theory, Continuum Mechanics
- 4 Jahre und 5 Monate, Aug. 1995 - Dez. 1999
Mechanical Engineering
Syracuse University
Mechanical Engineering major, Mathematics minor
Sprachen
Englisch
Muttersprache
Niederländisch
Gut
Deutsch
Gut
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