Ewa Napieralska

EM Simulations of IC packages, printed circuit boards, IC packages + PCB using Ansys Q3D, HFSS EM Simulations of EMI radiated emission RF measurements

Responsible for the integration of NI's RF products into test systems for wireless applications. Customer support and training for NI's soft- and hardware products. Specific knowledge in NI LabVIEW and TestStand

Development of measurement techniques and s-parameter characterization of memory components, modules and boards. Simulation of the electrical behavior of packages using Q3D and HFSS. Simulation of the electrical behavior of memory channels using Agilent ADS. Development of specifications for package parasitics in cooperation with international partner companies. Definition and RF-characterization of test-structures for the development of a TSV-interconnect technology. Responsible for the RF-lab

Multi-year working student at Infineon (Wireless Division) with focus on RF power-amplifiers. Diploma thesis "Investigation and Characterization of an Out-Phasing Power Amplifier for 2.5G and 3G Telecommunication Standards". Bachelor thesis "Development of Active RFID-Tags for 433MHz and 868MHz".