Justin Ahn

Managing BEANSCORP European HQ and a logistics company established in UK and started to have shipped Cafflano Klassic to over 20 countries in EMEA since April 2015.

Business Development in EMEA & Russia * Cafflano All-in-One Tumbler (Patented pour-over system on the go) * Cafflano Can-Grinder

European Sales Rep Company 1. Data Storage 2. Wireless Solution 3. Mobile Power Solution 4. Mobile Protection 5. Outdoor 6. Health, Beauty & Cleansing

European Sales Representative Company [Product Lines] 1) Dawin Electronics Co., Ltd. (www.dawinsemi.com) - Power Module (IGBT, Diode, MOSFET) 2) MagnaChip Semiconductor Ltd. (www.magnachip.com) - Power Discrete (MOSFET, IGBT) - Power Management IC (DC-DC, LED Driver)

Sales & Marketing Representative Europe Barun Electronics Co., Ltd 1) Flash Memory Cards (SD/microSD) 2) USB Flash Drives 3) SSD & System-in-Package Module Dawin Electronics Co., Ltd. Dawin’s Power Semiconductor Modules are designed for the compact and cost-effective configuration of converter circuits. 1) Diode Module (200~1200V, 60~300A) 2) IGBT Module (600/1200V, 50~400A) 3) MOSFET Module (500V, 50/100A)

• Power conversion analog product business across the focused-application segments in Europe. • Set up regional growth strategy for lighting segment • Promotional activities, Price management, Demand Forecast and Sales Target

• Full responsibility for all System LSI (Large-Scale Integration) product business in U.K. & Ireland. • Acting sales account manager for contract manufacturing companies • Ran intensively direct promotional activities on high-value added products of micro-controller and SoCs into consumer segments result in much profitable business from standard linear ICs

• New business plan from strategic alliance with silicon-valley companies to develop and manufacture application specific products. • Set up business environment of multi-media signal processor, cooperation model with RTOS, application software companies. • R&D project management

• Business plan for new value added product development through market and customers demand survey with a target spec, benchmarking competitors in application-specific standard product following initial promotional activities in the market. • Completed business plan for the first pager chipset, Initiated and set up multi-chip package team with a vehicle device of DSP & memory chip built-in product for digital answering machine phone.

• System level evaluation of wireless communication ICs for cordless telephone, Audio Amp, FM IF Receiver, Interface & Drive ICs