Karthik Narne

Plan and track all quality objectives and agree with the customer The development and implementation of the quality concept, as well as the coordination with the customer. Define, assess and track quality and customer requirements in terms of quality. Evaluate the maturity of the project and escalate it to the management, if necessary. The error analysis in case of product or process errors in the development phase advance.

Maintaining the relevant management system documentation of the Special Purpose Products (SPP)Business Division, based on the strategy. Defining the appropriate risk management requirements and deriving the required measures for the business processes in liaison with the process owners. Performing a controlling function in respect of adherence to statutory quality and environmental standards. Internal Auditing (based on EN ISO 9001 and 14001 standards) and performing external supplier audits(across EUROPE).

Acting as technical contact interface to main customers to improve the customer satisfaction (quality issues, product handling problems, ppm cooperation) Handling and resolving customer product returns, technical operations related complaints, and generating customer reports Driving the quality improvements process in view of cost reduction, quality increase and technical related issues Furthermore, I am responsible for: Secure Data-Key delivering, which is an exciting new business differentiator for NXP.

Drive and manage quality and reliability issues, as well as continuous improvement in all areas of interest. Provides Quality Engineering support and work with ams AG. Internal organization to resolve quality issues at customer site and improve product quality in the field. Co-operation within project team for review meetings, Design FMEAs, Test FMEAs, Process-FMEAs Supports product development, product qualification and release to production at ams AG and customer site to achieve expected quality on time

Perform a Scanpath and IDDQ Tests to Digital part on an IC using PXIsystem. Establishment of new FA-techniques for advanced technologies. RMA-processing: Initiates and recommends containment/corrective action on the basis of technical analysis Performs failure analysis on non-conforming material and does 8Dreporting Follows up improvement and corrective actions.

Compares different kinds of ADCs and DACs, including both internal and external ADCs and DACs on the microcontroller. These internal ADCs and DACs are built in to microcontroller MSP430FG4618 while external ADCs and DACs, are built separately on HPA-MCU interface board which is provided by Texas Instruments (ti). These converters can be controlled with the microcontroller. Finally, these results concluded with the identified errors of both INL and DNL from all the converters that are used.