Kieran Perkins

Angestellt, Chief Engineer for Hardware Integration - F35 Program, Northrop Grumman
Odenton, Vereinigte Staaten

Fähigkeiten und Kenntnisse

Project Management
Communication skills
Business Development
Team work
MS Office
Electrical Engineering
Agile Development
Earned Value Analysis
Mentorship
Atlassian
Design Thinking
Modeling and Simulation
Test Engineering
Data Analysis
Engineering Design, Semiconductor
RF Circuit Design

Werdegang

Berufserfahrung von Kieran Perkins

  • Bis heute 11 Monate, seit Mai 2025

    Chief Engineer for Hardware Integration - F35 Program

    Northrop Grumman

    - Chief engineer 20+ team to integrate and test Receiver Exciter designs for military antennas - Planning and executing product roadmap, engineering resources, and budget - Scaling logistics to transition tactical products for mass production and operational deployment - Balancing customer requirements with engineering limitations to guarantee product success - Leading hiring process to reduce gaps in expertise and improve team performance

  • 3 Jahre und 8 Monate, Mai 2022 - Dez. 2025

    Chief Engineer for Hardware Design

    Northrop Grumman

    - Chief engineer for 20+ mechanical and electrical engineers for communication array design, manufacturing, test, and integration - Addressed customer questions / concerns and delivered solutions that met customer goals - Engineered passive radiator PWB, RF personality PWB, Receiver Exciter, additive manufactured cold plate, coolant manifolds, interlocks, array test equipment - Forecasted and implemented Integrated Master Schedules with $4.5M total budget

  • 3 Jahre und 9 Monate, Jan. 2019 - Sep. 2022

    Chief Engineer for Integrated Circuit Designs

    Northrop Grumman

    - Led agile R&D investigations into system enabling concepts with $500K budget - Produced 15+ yearly disclosures resulting in advanced circuit performance - Reported on program feasibility, costs, and business process improvements to leadership

  • 4 Jahre und 7 Monate, März 2018 - Sep. 2022

    RF / Microwave IC Designer

    Northrop Grumman

    - Designed schematics and layouts for active and passive circuits (LNA, HPA, gain amp, attenuator, phase shifter, switch, splitter) from UHF to V bands covering 5:1+ octaves - Architected and integrated analog, digital, and RF components into a singular die - Debugged subcomponent outages to diagnose root cause and corrective action

  • 2 Jahre und 9 Monate, Juli 2015 - März 2018

    Superconducting IC Designer

    Northrop Grumman

    - Developed and tested high frequency digital processing capabilities utilizing RQL circuit design - Refined PTL capabilities to enable long range and off-chip signal routing - Restructured circuit user interface through parameterized cells of PTL building blocks

Ausbildung von Kieran Perkins

  • 2 Jahre und 7 Monate, Juni 2016 - Dez. 2018

    Electrical Engineering

    Johns Hopkins University

  • 3 Jahre und 10 Monate, Aug. 2011 - Mai 2015

    Electrical and Computer Engineering

    North Carolina State University

Sprachen

  • Englisch

    Muttersprache

  • Deutsch

    Grundlagen

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