
Kieran Perkins
Fähigkeiten und Kenntnisse
Werdegang
Berufserfahrung von Kieran Perkins
- Bis heute 11 Monate, seit Mai 2025
Chief Engineer for Hardware Integration - F35 Program
Northrop Grumman
- Chief engineer 20+ team to integrate and test Receiver Exciter designs for military antennas - Planning and executing product roadmap, engineering resources, and budget - Scaling logistics to transition tactical products for mass production and operational deployment - Balancing customer requirements with engineering limitations to guarantee product success - Leading hiring process to reduce gaps in expertise and improve team performance
- 3 Jahre und 8 Monate, Mai 2022 - Dez. 2025
Chief Engineer for Hardware Design
Northrop Grumman
- Chief engineer for 20+ mechanical and electrical engineers for communication array design, manufacturing, test, and integration - Addressed customer questions / concerns and delivered solutions that met customer goals - Engineered passive radiator PWB, RF personality PWB, Receiver Exciter, additive manufactured cold plate, coolant manifolds, interlocks, array test equipment - Forecasted and implemented Integrated Master Schedules with $4.5M total budget
- 3 Jahre und 9 Monate, Jan. 2019 - Sep. 2022
Chief Engineer for Integrated Circuit Designs
Northrop Grumman
- Led agile R&D investigations into system enabling concepts with $500K budget - Produced 15+ yearly disclosures resulting in advanced circuit performance - Reported on program feasibility, costs, and business process improvements to leadership
- 4 Jahre und 7 Monate, März 2018 - Sep. 2022
RF / Microwave IC Designer
Northrop Grumman
- Designed schematics and layouts for active and passive circuits (LNA, HPA, gain amp, attenuator, phase shifter, switch, splitter) from UHF to V bands covering 5:1+ octaves - Architected and integrated analog, digital, and RF components into a singular die - Debugged subcomponent outages to diagnose root cause and corrective action
- 2 Jahre und 9 Monate, Juli 2015 - März 2018
Superconducting IC Designer
Northrop Grumman
- Developed and tested high frequency digital processing capabilities utilizing RQL circuit design - Refined PTL capabilities to enable long range and off-chip signal routing - Restructured circuit user interface through parameterized cells of PTL building blocks
Ausbildung von Kieran Perkins
- 2 Jahre und 7 Monate, Juni 2016 - Dez. 2018
Electrical Engineering
Johns Hopkins University
- 3 Jahre und 10 Monate, Aug. 2011 - Mai 2015
Electrical and Computer Engineering
North Carolina State University
Sprachen
Englisch
Muttersprache
Deutsch
Grundlagen
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