Konstantin Mogilevsky

Angestellt, TD BAW Staff Engineer, RF360 Europe GmbH - A Qualcomm TDK Joint Venture
Abschluss: Master of Science, Technische Universität Dresden
Munich, Germany

Werdegang

Berufserfahrung von Konstantin Mogilevsky

  • Current 9 years and 4 months, since Feb 2017

    TD BAW Staff Engineer

    RF360 Europe GmbH - A Qualcomm TDK Joint Venture

    R&D and TD in bulk acoustic wave (BAW) division of RF360jv. Implementation and industrialization of chemical mechanical polish (CMP) process. Development and improvement of further technology. Research and development of new CMP processes.

  • 5 years and 4 months, Nov 2011 - Feb 2017

    Senior Process Engineer

    GLOBALFOUNDRIES

    Process Development, Process Transfer, Large Volume Manufacturing of ICs, Cu CMP, Backend Integration. Development activities focused in the area of interconnects including etching, cleaning, metal deposition and chemical mechanical polishing. Metrology associated with the above processes.

  • 3 years and 7 months, Apr 2008 - Oct 2011

    Process Engineer

    Intel Corporation

    Process engineer (Chemical Mechanical Polish Group) - Micron Fab12 (Ex-Intel Fab18), Kiryat-Gat. 1. Line maintenance management: stability of process and equipment, product quality, work specifications, validation and upgrading tools configuration, failure analysis, real-time support. 2. New product introduction (NPI), new technology introduction (NTI) from R&D to production. 3. R&D projects: cost reduction, life extension of consumables, product quality, productivity and efficiency.

  • 6 years and 11 months, Jun 2001 - Apr 2008

    Process Technician

    Intel Corporation

    Process technician in Chemical Mechanical Polish: 1. Quality assurance. 2. Participate in projects of improving process and equipment characteristics in the module. 3. Troubleshooting of in-line and end of line problems caused during the process. 4. Training for process techs.

Ausbildung von Konstantin Mogilevsky

  • 3 years and 3 months, Oct 2014 - Dec 2017

    Organic and Molecular Electronics

    Technische Universität Dresden

  • 4 years and 6 months, Oct 2005 - Mar 2010

    Advanced Materials

    Hebrew University of Jerusalem

  • 1 year and 8 months, Oct 2002 - May 2004

    Electronics Engineering

    Sapir Academic College

    Microelectronics

Sprachen

  • Russian

    C2 (Verhandlungssicher / Muttersprachlich)

  • English

    C2 (Verhandlungssicher / Muttersprachlich)

  • German

    C1 (Fließend)

  • Hebrew

    C2 (Verhandlungssicher / Muttersprachlich)

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